Introduction To PDN Analyzer Webinar Recap May 10, 2018

Alexsander Tamari
|  已创建:五月 11, 2018  |  已更新:February 8, 2021

If you joined us for the May 10th, 2018, PDN Analyzer webinar then the following will be a recap, if not here’s what you missed. You can also view the presentation slides and recording.

Key Takeaways about PDN

Power Delivery Network () Design Issues

  • Low supply voltage at load components.

A low supply voltage at your loads can cause issues like processors outputting faulty logic. These things happen when there is an unexpected voltage drop.

  • Delamination and via separation

If your current is too high it creates too much heat in the copper delaminating the board and/or separating vias. With via(s) destroyed so is the functionality of the board.

  • Copper plane resonance

Copper island and peninsulas can be a cause for concern as they can resonate with with other signals on and even outside of your board. Troubleshooting these is very difficult, its best to find and fix these issues before they occur.

Why You Need

  • Solve above issues
  • Increase productivity with an efficient and realistic workflow
  • Work in your current design environment

Q&A

Q: What determines PASS/FAIL conditions?

A: PASS/FAIL conditions are determined by the user and can be set for each source or load.

Q: Is there any plan to add temperature estimation?

A: This is something we know that people want and we are currently looking into how to best implement this.

Q: Are there any plans to implement AC analysis?

A: Yes, we plan to continue improve which includes adding AC analysis.

Q: Can you reverse the color scale?

A: Not at this point but we are currently working on this functionality.

Q: Can loads in multi-channel instances be added in batch?

A: Yes. But remember when you load different network configurations in batch mode each configuration will be simulated individually from each other.

Q: Can you change copper weight?

A: Not at this point. But you can change how the conductivity and resistivity of the metal is defined.

Q: Does it handle blind vias?

A: Yes, can handle blind, buried and standard vias.

Q: Does PDNA simulate with multiboard?

A: Currently it does not, you would need to analyze each board individually.

Q: Can PDNA provide inductance of the power path?

A: No. Reactive attributes of the copper structures are not calculated because PDNA currently focuses on DC.

 

Ready to look around for yourself? Try the PDN free trial today.

关于作者

关于作者

Alexsander担任Altium的技术营销工程师,为团队带来了他沉淀多年的工程专长。他把对电子设计的一腔热情与实践经验相结合,为Altium的营销团队提供了独特的视角。Alexsander毕业于世界排名前20的大学——加州大学圣地亚哥分校,并获得了电气工程学士学位。

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