The PCB is designed and formed as a stack of layers. In the early days of printed circuit board (PCB) manufacturing, the board was simply an insulating core layer clad with a thin layer of copper on one or both sides. Connections are formed in the copper layer(s) as conductive traces by etching away (removing) unwanted copper. Fast forward to today, where almost all PCB designs have multiple…
The traditional approach to circuit board design has been to place the components on the top and bottom surfaces of the board. This process is well supported by circuit board assembly houses, which typically use automated pick and place machines to position each component, ready to be soldered onto the surface. The ever-increasing demand for smaller and more integrated electronic products,…
How many of us got into electronics because we were drawn by the myriad of cool switches, knobs, lights and other suitably gadget-centric controls? Fast forward a good few years and that allure is still there, only it is now replaced with the "Snazzy GUI" factor - electronic products that have a sleek, sexy interface. Central to these ever-advancing (and shrinking) product interfaces is touch…
The Technology 目前用于制造印刷电子电路的技术包括: 激光直接成型 - 在需要制造精细导体结构时使用。 3d打印 - 成型 DuPont InMold - 将电路印刷到塑料基板上,然后将其热成型并注塑成最终产品形状。 双射成型 - 这是用于具有粗导体结构的大量生产的极好方法。 技术差异 就技术提供的内容而言,任务是一样的 - 将电子元件通过导电通路连接在一起,形成一个执行特定功能的电子电路。不同之处在于电路构建的方法。 从设计角度来看,传统的印刷电路板(PCB)被设计为一系列导电层,每个导电层通过绝缘层与其相邻的导电层隔开。导电信号通路定义在这些导电层上。每个信号都留下一个元件插脚,水平地蜿蜒穿过导电层。当信号路径被现有的信号通路阻挡时,或者当信号需要到达另一个导电层上的元件插脚时,信号会垂直向上或向下移动通过相邻的绝缘层到达另一个导电层…
When using a Standalone or Private Server license, you may need to reactivate/refresh that license to be able to access and use the wire bonding functionality. For a Standalone license, this is performed from the License Management view. For a Private Server license hosted in the Altium On-Prem Enterprise Server or Altium Infrastructure Server, this is performed from the Admin – Licenses page of…
借助 Ultra HDI PCB 技术,设计更轻、更小的电子产品。了解该技术在卫星、可穿戴设备和电动汽车系统中已验证的 SWaP 改进成效。
了解为什么 Ultra HDI (UHDI) 技术中的铜电镀工艺十分复杂。探索纵横比和堆叠微孔等设计决策如何影响制造的可靠性与成功率。
通过面向检测的设计实践,满怀信心地验证超高密度互连(Ultra HDI)电路板。了解焊盘几何形状、间距以及 AOI 设置如何在高密度尺度下确保 PCB 质量。
了解 Ultra HDI 如何改变 PCB 组装要求。探索细间距 BGA 布局中的钢网设计、检测限制以及返修约束。
了解 Ultra HDI 如何通过新的工艺极限、材料挑战以及更严格的要求,重塑 PCB 设计与制造,从而实现可靠生产。
BGA 封装有多种不同的焊球间距,每种间距都要求在 PCB 扇出布线时采用特定的过孔尺寸。
Optimize your Ultra HDI design review. Learn what to check for microvias, materials, impedance, and manufacturing limits to ensure reliable UHDI PCB performance.
Understand fabrication tolerances that shift UHDI layers by microns. Apply layout choices that prevent opens, shorts, and rework.
Printed circuit board designers have an exciting new tool to use to help solve complicated routing challenges. Fabricators serving the low to medium-volume, high-mix markets are now offering Ultra-HDI technology, fabricating circuit layers with semi-additive processes. This gives PCB designers a number of key benefits: the ability to route with 25-micron trace and space with highly precise traces, the ability to use larger feature sizes with
Tara Dunn interviews Mike Vinson, COO of Averatek, to discuss the Ultra HDI and package substrate market.
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