Ebook: Routing High-Density Interconnects with Reliable Microvias

As electronics have become miniaturized, the technologies used to route interconnects have been pushed to their limits, and new modes of designing PCBs with high reliability have become standard. HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. Some simple design decisions will have a major impact on reliability and solvability in an HDI PCB layout.

In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias. Covered topics include:

• Warnings from the IPC regarding reliability of via structures in HDI PCBs
• How to design microvias to ensure reliability
• How to create a PCB stackup for a high density circuit board
• How to set up design rules for layout and routing in HDI PCB design

Click the PDF above to read more about routing in an HDI PCB layout and how to design interconnects for HDI PCBs. You can also read the original, full-length content here:

The IPC Warning About Microvia Reliability for High Performance Products
Everything You Need to Know About Microvias in Printed Circuit Design
Advanced High Density PCB Design in Altium Designer
How to Setup HDI PCB Layout and Routing in Your PCB Design Software

下载PDF