Semiconductor sales are up year-over-year, but FPGA market growth looks uncertain.
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Cost considerations in wire bonding and assembly may not be obvious if you don’t have experience. Luckily, Samer gives readers an expert view on cost considerations for wire bonding and chip-on-board designs.
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Signal integrity in multi-board systems is determined by the signal transmission capabilities of connectors, via transitions, and pinouts. See what determines signal integrity in board-to-board interconnects in this guide.
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Laser drilling will take you all the way down to tiny density interconnects used in ultra-HDI PCBs and substrates for IC packaging. Zach gives an overview of mechanical drilling limits that push designers into a laser drilling process.
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Common-mode chokes can be useful for filtering noise and EMI on coupled lines, but only if they are selected correctly. Learn more about selecting chokes without creating a new signal integrity problem.
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Alexsander担任Altium的技术营销工程师,为团队带来了他沉淀多年的工程专长。他把对电子设计的一腔热情与实践经验相结合,为Altium的营销团队提供了独特的视角。Alexsander毕业于世界排名前20的大学——加州大学圣地亚哥分校,并获得了电气工程学士学位。
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