Sub-25 Micron Traces with Averatek ASAP Technology

High-density designs, simplified. Averatek offers a disruptive solution for complex electronic design.

We are very fortunate to have the powerhouse executive team from Averatek Corporation, a company that develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging, and RF and millimeter-wave electronics. 

Haris Basit, Averatek’s CEO together with Mike Vinson the COO, and Tara Dunn the VP of Business Development and Marketing will share with us some exciting breakthroughs in miniaturization technology.

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Show Highlights:

• Introductions, and Averatek Technology Overview
  • Founded out of SRI in Silicon Valley
  • PCB Industry in North America is ripe for disruption
• Definitions: MSAP, ASAP and Subtractive processes
  • ASAP is Averatek semi-additive process and is achieved with a liquid metal ink catalyst and plated up from the seed layer
• PCB design benefits of Averatek technology
  • Simplify the design
  • Reduction in number of layers and lamination cycles
  • Increased density and miniaturization
  • Signal integrity improvements
  • Applications are military, medical and communications
• Material suitable for ASAP high-performance design:
  • Epoxy-based substrates
  • High-frequency materials (including Teflon)
  • High-speed materials
  • Some flex materials
  • Thin materials
• Shorten the learning curve for PCB designers with Tomas Chester design project in partnership with Averatek coming soon on Altium Resource Hub
• Example design optimization:
  • Smaller footprint, increased panel usage
  • 12 layer board became 8 layer board
  • 3 lamination cycle to 1 lamination cycle
  • Simplified design, increased reliability, significantly lower costs

Links and Resources:

Averatek Website
Fabricators offering Averatek:

• Calumet Electronics
• American Standard Circuits (ASC)
• FTG Circuits

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