UHDI, AI, and Solder Paste Innovation | OnTrack PCB Design Podcast

Zachariah Peterson

| 已创建：February 5, 2025 | 已更新：January 15, 2026

UHDI, AI, and Solder Paste Innovation | OnTrack PCB Design Podcast

Join Tech Consultant Zach Peterson as he chats with Tony Lentz, Chemist and Field Application Engineer with FCT Assembly, about the latest innovations in solder paste for ultra-high density interconnects (UHDI) and the challenges of working with smaller solder powder sizes. The pair also discusses the role of AI in electronics manufacturing and the future of PCB assembly.

Tony brings his deep knowledge of materials science and the chemistry of electronics to this insightful discussion, providing valuable perspectives on industry trends and advanced packaging techniques. Tune in to learn about the exciting developments shaping the future of electronics manufacturing.

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关于作者

关于作者

Zachariah Peterson拥有学术界和工业界广泛的技术背景。在从事PCB行业之前，他曾在波特兰州立大学任教。他的物理学硕士研究课题是化学吸附气体传感器，而应用物理学博士研究课题是随机激光理论和稳定性。他的科研背景涵盖纳米粒子激光器、电子和光电半导体器件、环境系统以及财务分析等领域。他的研究成果已发表在若干经同行评审的期刊和会议论文集上，他还为多家公司撰写过数百篇有关PCB设计的技术博客。Zachariah与PCB行业的其他公司合作提供设计和研究服务。他是IEEE光子学会和美国物理学会的成员。

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