Unleashing your High Density PCB Designs

Judy Warner

| 已创建：五月 18, 2021

Unleashing your High Density PCB Designs

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Show Highlights:

Understanding Semi Additive Process (SAP) and Modified Semi Additive Process (MSAP)
MSAP isn’t new, but it’s growing to adoption, what’s driving that?
What makes MSAP especially applicable now?
Benefits of Laser Direct Imaging (LDI) for PCB designers and manufacturers
- What are the design implications and benefits? What exactly can you do with it?
The methods/materials used for this technology?
- Chemical Technology, Averatec
- Ultra-thin copper, Insulectro

Links and Resources:

Insulectro Webinar on MSAP
Insulectro Website
(Insulectro Webinars Library available near the bottom of their homepage)
Chris Hunrath LinkedIn profile
Averatek Podcast on Additive Manufacturing

Altium 365: Where the World Designs Electronics

Explore Altium Develop Explore Altium Agile Ask an Expert

关于作者

关于作者

Judy Warner在电子行业的不同领域有超过25年的经验。她拥有PCB制造、射频和微波PCB以及合同制造的背景，专攻Mil/Aero应用。她还在多家行业出版物撰写文章、博客和日志，例如Microwave Journal、PCB007 Magazine、PCB Design007、PCD&F和IEEE Microwave Magazine，并且是PCEA（印刷电路工程协会）的活跃委员会成员。2017年，Warner加入Altium，担任社区参与总监。除了主持OnTrack Podcast和创建OnTrack Newsletter外，她还推出Altium年度用户研讨会AltiumLive。Warner致力于为全球PCB设计工程师提供资源、支持和建议。

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