Types of PTFE Materials for RF PCB Design

Zachariah Peterson
|  已创建:July 5, 2023  |  已更新:March 16, 2024
Types of PTFE Materials for RF PCB Design

RF PCB designs often make use of low-loss PTFE-based materials thanks to their very low dielectric losses and huge range of possible Dk values. These materials use polytetrafluoroethylene (PTFE) as the base material, but this is not the only constituent in these laminate materials. There are also reinforcements and fillers that are used to engineer PTFE PCB materials to have their required material properties.

Commercially available PTFE-based materials are available with or without reinforcement, but it is the designer’s job to specify what they need to ensure reliability and functionality. Before you run off selecting just any PTFE-based material for your board, make sure you understand how fillers and reinforcements in PTFE laminates affect your board’s operation.

Material Components in PTFE Laminates

PTFE-based materials include two main material components that define their material properties:

  • Reinforcement - provides rigidity
  • Filler - ceramic powders used to engineer the material properties

PTFE laminates used in PCBs use ceramic particles as a filler material to engineer the material properties of the laminate material. The exact effects on material properties depend on the type of ceramic used and its content in the substrate, and this is largely the intellectual property of PTFE laminate manufacturers.

In addition to the use of ceramic fillers to engineer thermal, mechanical, and electromagnetic properties, PTFE-based laminates can include a reinforcement in the PTFE matrix.

Glass Weave Reinforced

Glass reinforcements are a standard reinforcement used in PTFE-based materials for RF PCBs. These reinforcements are the same woven glass fabric styles that are found in standard epoxy-fiberglass laminates. Due to the lower rigidity of PTFE laminate materials compared to FR4, reinforcement can increase the overall rigidity of the board if that is required to ensure reliability. It also simplifies drilling throughout a stackup, including in hybrid stackups.

The typical glass styles used for reinforcement include:

  • 1078
  • 106
  • 1080
  • Spread/flat glass

How do these weave styles differ, and how do they create differences in phase response across circuits? In general, more open weaves will create greater deviation between your target phase response on an interconnect, and the actual (measured) phase response, which is the classic fiber weave effect. This is bad for any phase-sensitive system, such as phased arrays.

Glass weaves used in PTFE materials

If you need to design and manufacture a system with a target phase response with minimal skew, then you should use spread/flat glass reinforcement, or no reinforcement at all. There are also non-woven glass and ceramic reinforcements.

Non-Woven Glass Reinforced

There is also a type of glass reinforcement that is completely random. In this PTFE-based material, you can typically find the same level of mechanical rigidity you would find in woven-reinforced laminates, but without the same level of fiber weave effects you would see in a woven-reinforced laminate. The use of non-woven glasses in PTFE laminates is much less common because not all manufacturers offer this option in their materials. However, if it is offered (see below), the material properties in woven vs. non-woven reinforced PTFE are similar.

Non-woven glass reinforced PTFE
These table entries compare PTFE-based materials with woven and non-woven reinforcements.

Ceramic Reinforced vs. Ceramic Filled

The use of glass reinforcements has allowed the use of thinner PTFE-based materials in PCB stackups, which requires rigidity be enforced in the PTFE matrix. However, glass is not the only available reinforcement; ceramic reinforcements are also used to provide rigidity. These reinforcements also provide the same function as fillers, but they do not provide the same kind of mechanical reinforcement as glass weaves.

I bring up ceramic as a reinforcement because these materials are sometimes called out specifically as ceramic reinforcements, not just ceramic fill. Ceramic reinforcement does not contain a weave style, and so you do not have fiber weave effects in the PCB laminate. However, the line between ceramic reinforcement and ceramic filling is blurry and some vendors may use these two terms interchangeably. Be careful to check whether there is a meaningful difference before finalizing a material selection.

Unreinforced

Finally, there are unreinforced PTFE laminates, which only contain a ceramic microparticle filler and additives, but no other reinforcements. Many of the PTFE-based laminate products you will find available are available in reinforced or unreinforced varieties. I think most designers assume that their PTFE laminate will be unreinforced, but unless you specify exactly what you need you will be at the mercy of your fabrication house’s material stocks.

Advantages: Why would we use an unreinforced material? We would do this if we want to eliminate any possibility of the reinforcement creating fiber weave or skew effects along interconnects in the substrate material. This is the main advantage of these materials, especially for use in very high frequency systems like radar. There are also benefits in high-density advanced radars that might use blind vias on outer buildup layers, namely:

  • Skew elimination across phase-matched RF lines
  • Elimination of knuckle areas where fiber strands overlap
PTFE PCB radar
Unreinforced (ceramic-filled only) PTFE materials are beneficial in these advanced 2D scanning-imaging radars with many phase-matched antennas. This image comes from Israeli startup Arbe.

Disadvantages: The main disadvantage of an unreinforced PTFE-based material is its lack of rigidity before it is applied into a stackup and cured. This can result in layer-to-layer misregistration, particularly in drill holes and pads, which could have some slight misalignment. On the modern boards I mentioned above, this can be a significant source of return loss at very high frequencies.

I don’t want to say that these materials will always have greater misregistration, but it is possible for them to have greater misregistration if your fabrication house is not experienced working with these materials. I have heard an application engineer from Rogers describe these unreinforced laminates as “wet noodles”, meaning they are very limp and can flex when being added to the stackup. If you are going to use unreinforced, make sure your fabricator is experienced in handling these materials.

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关于作者

关于作者

Zachariah Peterson拥有学术界和工业界广泛的技术背景。在从事PCB行业之前,他曾在波特兰州立大学任教。他的物理学硕士研究课题是化学吸附气体传感器,而应用物理学博士研究课题是随机激光理论和稳定性。他的科研背景涵盖纳米粒子激光器、电子和光电半导体器件、环境系统以及财务分析等领域。他的研究成果已发表在若干经同行评审的期刊和会议论文集上,他还为多家公司撰写过数百篇有关PCB设计的技术博客。Zachariah与PCB行业的其他公司合作提供设计和研究服务。他是IEEE光子学会和美国物理学会的成员。

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