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浏览我们的PCB设计和行业信息过去简讯

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Ensuring EMC Through A Validation Ecosystem Ensuring EMC Through A Validation Ecosystem: Anechoic Chambers, Motor Bench, and Advanced Simulation 6 min Newsletters 电气工程师 电气工程师 电气工程师 ROHM's R&D facilities integrate EMC testing, motor bench evaluation, and advanced simulation to tackle electromagnetic noise, efficiency, and thermal challenges. Together, they create a preventive validation ecosystem that accelerates development and ensures reliable, compliant electronic systems. 阅读文章
What to Spec Around Wide-Bandgap Switches What to Spec Around Wide-Bandgap Switches 10 min Newsletters Systems Engineers/Architects PCB 设计工程师 电气工程师 Systems Engineers/Architects Systems Engineers/Architects PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Define the right specs for SiC and GaN power stages. Learn how to control switching behavior, isolation, sensing, magnetics, and layout for a clean first spin. 阅读文章
The Board-Level Trends Defining Wide-Bandgap Power The Board-Level Trends Defining Wide-Bandgap Power 8 min Newsletters PCB 设计工程师 电气工程师 Systems Engineers/Architects PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Systems Engineers/Architects Systems Engineers/Architects Explore board‑level trends shaping wide‑bandgap power. Learn how SiC and GaN impact layout, EMI, isolation, sensing, and packaging for next‑generation designs. 阅读文章
Designing for 224G High-Speed Connectors, Flyover Cables, and the Road to Co-Packaged Optics Designing for 224G: High-Speed Connectors, Flyover Cables, and the Road to Co-Packaged Optics 9 min Newsletters Systems Engineers/Architects PCB 设计工程师 电气工程师 Systems Engineers/Architects Systems Engineers/Architects PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Design 224G channels with the right connectors and flyover cables. Plan for shorter reach. Keep serviceability in view. 阅读文章
Top Trends in Emerging Connector Technologies Top Trends in Emerging Connector Technologies 8 min Newsletters Systems Engineers/Architects 电气工程师 PCB 设计工程师 Systems Engineers/Architects Systems Engineers/Architects 电气工程师 电气工程师 PCB 设计工程师 PCB 设计工程师 Plan connector choices earlier in the design. See 2026 trends in bandwidth, power density, and sustainability. 阅读文章
7 Trends Shaping MCUs in 2026: Design Impacts and What to Spec 7 Trends Shaping MCUs in 2026: Design Impacts and What to Spec 7 min Newsletters Systems Engineers/Architects PCB 设计工程师 电气工程师 Systems Engineers/Architects Systems Engineers/Architects PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Design smarter MCUs. Size for WLCSP, plan Thread/Matter, secure OTA, and pick toolchains that cut bring-up. Get clear guidance on what to spec. 阅读文章
10 Top Electronic Component Innovations of 2025 10 Top Electronic Component Innovations of 2025 7 min Newsletters PCB 设计工程师 电气工程师 PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Discover silicon breakthroughs in MCUs, connectivity, power, and imaging; higher capability in smaller, cooler footprints with credible roadmaps and availability. 阅读文章