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Interplane Capacitance and PCB Stackups Interplane Capacitance and PCB Stackups 13 min Blog PCB 设计工程师 PCB 设计工程师 PCB 设计工程师 This article is intended to provide insights on interplane capacitance and guidance for the process of designing PCB stackups. It 阅读文章
buried via pcb Creative Design with Buried Vias in Your Next PCB 7 min Blog PCB 设计工程师 PCB 设计工程师 PCB 设计工程师 Blind and buried vias can be very useful tools in a PCB designer's toolbox. If they are not used correctly 阅读文章
Impedance Controlled Routing for Boards Made in Altium Designer Impedance Controlled Routing for Boards Made in Altium Designer 9 min Blog PCB 设计工程师 PCB 设计工程师 PCB 设计工程师 Computing requirements and applications require data to be processed at faster rates than ever before. As communication bands start to 阅读文章
46:09 Injection Molded Structural Electronics: Creating Smart Surfaces with Electronic Functionality 12 min Videos 机械设计工程师 PCB 设计工程师 Systems Engineers/Architects +1 机械设计工程师 机械设计工程师 PCB 设计工程师 PCB 设计工程师 Systems Engineers/Architects Systems Engineers/Architects 电气工程师 电气工程师 Watch how IMSE technology integrates electronics into 3D molded plastics to create sleek, durable smart surfaces in this Altium Live session with TactoTek. 阅读文章
41:29 You Design & You Manufacture: Additive Manufacturing of Complex Multilayer Circuits 35 min Videos PCB 设计工程师 电气工程师 PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Explore how additive manufacturing empowers designers to prototype complex multilayer PCBs in-house - faster, securely, and with complete design freedom. 阅读文章
How Integrated Tools Ease Multi-board PCB Systems Design How Integrated Tools Ease Multi-Board PCB Systems Design 7 min Blog PCB 设计工程师 电气工程师 Systems Engineers/Architects PCB 设计工程师 PCB 设计工程师 电气工程师 电气工程师 Systems Engineers/Architects Systems Engineers/Architects Want to get better at multi-PCB design? See how integrated design and verification tools help you build your next multi-board system. 阅读文章
Get to Know Microvia Manufacturing Processes and HDI Substrates Get to Know Microvia Manufacturing Processes and HDI Substrates 9 min Blog PCB 设计工程师 PCB 设计工程师 PCB 设计工程师 Initial HDI Fabrication High Density Interconnect printed circuits actually started in 1980, when researchers started investigating ways to reduce the 阅读文章